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PCB Capability

Technical index2 Mass Batch Small batch Sample
Base Material FR4 Normal Tg Shengyi S1141、KB6160、Huazhen H140(not suitable for lead free process )
Middle Tg For HDI、multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662;
High Tg For thick copper、high layer:SY S1000-2;  ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HR; TU-752;
Halogen Free Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg:  SY S1165
High CTI CTI≥600 SY S1600、Huazheng H1600HF、H1600A;
High Frequency Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000
High Speed SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380
Flex Material Base Glue-free:Dupont AK  XingyangW-type, Panosonic RF-775;
Coverlay SY SF305C、Xingyang Q-type
Special PP No flow PP:       VT-447LF,Taiguang 370BL   Arlon 49N
Ceramic filled adhesive sheet:   Rogers4450F
PTFE adhesive sheet:    Arlon6700、Taconic FR-27/FR-28
Double-sided coatingPI:  xingyang N-1010TF-mb
Metal Base Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase
Special High heat resistance rigidity PI: Tenghui VT-901、Arlon 85N,SY S260(Tg250)
High thermal conductivity material:92ML
Pure ceramic material:alumina ceramic、Aluminum nitride ceramics
BT material:   Taiwan Nanya NGP-200WT
Layers FR4 24 36 64
Rigid&Flex /(Flex) 16(12) 20(12) 24(16)
High Frequency Mixed Lamination 12 18 24
100% PTFE 4 12 18
HDI 2 steps 3 steps 4 steps
Technical Index Mass Batch Small Batch Sample
Delivery Size Max(mm) 460*560 460*560 550*900
(mm) Min(mm) 20*20 10*10 5*10
Width / Gap Inner(mil) 0.5OZ base copper:  3/3      1.0OZ base copper:  4/4     2.0OZ base copper:  5/6
3.0OZ base copper:  7/9      4.0OZ base copper: 8/12     5.0OZ base copper: 10/15
6.0OZ base copper: 12/18     10 OZ base copper: 18/24    12 OZ base copper: 20/28
Outer(mil) 1/3OZ base copper:  3/3     0.5OZ base copper:  4/4     1.0OZ base copper:  5/5
2.0OZ base copper:  6/8     3.0OZ base copper: 7/10     4.0OZ base copper: 8/13
5.0OZ base copper: 10/16    6.0OZ base copper: 12/18    10 OZ base copper: 18/24
12 OZ base copper: 20/28    15 OZ base copper: 24/32
Line Width Tolerance >5.0 mil ±20% ±20% ±1.0mil
≤5.0 mil ±1.0mil ±1.0mil ±1.0mil
Copper Thickness Inner layer(OZ) 4 6 12
Out layer(OZ) 4 6 15
Drilling Min laser (mm) 0.1 0.1 0.1
Min CNC(mm) 0.2 0.15 0.15
Max CNC drill bit(mm) 6.5 6.5 6.5
Min Half Hole(mm) 0.5 0.4 0.4
PTH Hole (mm) Normal ±0.1 ±0.075 ±0.075
Pressing Hole ±0.05 ±0.05 ±0.05
Hole Angle (conical) Width of upper diameter≤6.5mm:800、900、1000、1100;Width of upper diameter≥6.5mm:900;
Precision of Depth-control Drilling(mm) ±0.10 ±0.075 ±0.05
Number of blind CNC holes of one side ≤2 ≤3 ≤4
Minimum via hole spacing (different network, military, medical, automobile )mm 0.5 0.45 0.4
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm 0.4 0.35 0.3
Technical index Mass batch Small batch sample
Drilling The minimum hole wall spacing of the over hole (the same network mm) 0.2 0.2 0.15
Minimum hole wall spacing (mm) for device holes 0.8 0.7 0.7
The minimum distance from via hole to the inner copper or line 0.2 0.18 ≤10L: 0.15
>10L: 0.18
The min distance from Device hole to inner copper or line 0.3 0.27 0.25
Welding Ring Via hole 4(HDI 3mil) 3.5(HDI 3mil) 3
(mil) Component hole 8 6 6
Solder Dam (mil) (solder mask) 5 4 4
(hybrid) 6 5 5
Final Board Thickness >1.0 mm ±10% ±8% ±8%
≤1.0 mm ±0.1mm ±0.1mm ±0.1mm
Board thickness(mm) 0.5-5.0 0.4-6.5 0.3-11.5
Board thickness/drill bit 10:01 12:01 13:01
Via hole(drill bit)plug hole(plug solder ) 0.25-0.5mm 0.20-0.5mm 0.15-0.6mm
Blind buried hole, hole inside pad 0.25-0.5mm 0.20-0.5mm 0.10-0.6mm
Bow and twist ≤0.75% ≤0.75% ≤0.5%
Impedance Control ≥5.0mil ±10% ±10% ±8%
<5.0mil ±10% ±10% ±10%
CNC contour tolerance(mm) ±0.15 ±0.10 ±0.10
V-CUT Tolerance of residual thickness(mm) ±0.15 ±0.10 ±0.10
(mm)
Routing slot(mm) ±0.15 ±0.10 ±0.10
Precision of controlled deep milling(mm) ±0.15 ±0.10 ±0.10
Technical index Mass batch Small batch sample
Contour Bevel edge 20~60 degree;±5degree
Surface Treatments Immersion gold Ni thickness 118-236 118-236 118-236
(micro inch)
Max gold (uinch) 3 3 6
Hard gold(Au thick) Gold finger 15 30 60
(uinch)
NiPdAu NI 118-236
(uinch)
PA 2月5日
(uinch)
Au 1月5日
(uinch)
Graph electric gold NI 120-400
(uinch)
AU 1月3日
(uinch)
Immersion tin Tin 0.8-1.2
(um)
Immersion Ag Ag 6月10日
(uinch)
OSP thick 0.2-0.5
(um)
HAL/HAL LF BGApad(mm) ≥0.3×0.3
thickness 0.6≤H≤3.0
(mm)
Board thickness vs hole diameter Press hole≤3:1
Tin(um) 2.0-40.0
Rigid & Flex Maximum dielectric thickness of flex Glue –free 25um Glue-free 75um Glue-free75um
Flex part width(mm) ≥10 ≥5 ≥2
Max delivery size (mm) 200×400 200×500 400 ×550
distance of via hole to edge of Rigid&flex(mm) ≥1.2 ≥1.0 ≥0.8
(mm)distance of components hole to the edge of R&F ≥1.5 ≥1.2 ≥1.0
Technical index Mass batch Small batch sample
Rigid & Flex Structure The outer layer structure of the flex part, the PI reinforcement structure and the separation structure Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film
Special Tech Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination Buried magnetic core PCB Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB,  buried riveting nut PCB, embedded components PCB