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FR4 PCB Capability

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FR4 PCB Capability

Items FR4 PCB Capability
Max Layer Count 32 Layer
Min Board Thickness 5.0 mil (0.13mm) (1 L)
6.0 mil (0.15mm) (2 L)
16 mil (0.4mm) (4 L)
24 mil (0.6mm) (6 L)
32 mil (0.8mm) (8 L)
40 mil (1.2mm) (10 L)
Max Board Thickness 2L: 236mil (6mm)
≥4L: 315mil (8mm)
Max Board Dimension 24*24″ (610*610mm) 4*51″(100*1,300mm)
Max Conductor Thickness 20 OZ (27.56mil)
Min Conductor Thickness 1/2 OZ (0.7 mil)
Min Trace Width/Space Normal: 4/4 mi
Min PTH Hole Diameter Normal: 6 mil (0.15mm) ;
Min PTH slot diameter 20mil (0.50mm)
Min Hole Spacing 12 mil (0.3mm)
Max Aspect Ratio 10:01
Min Solder PAD Dia Normal: 14mil (0.35mm)
3mil (0.075mm)
PTH Wall Thickness 0.8mil (18um) for normal
PTH Dia Tolerance ± 3 mil (0.075mm)
NPTH Dia Tolerance ±2 mil (0.05mm)
Hole Position ±2 mil (0.05mm)
Outline Tolerance CNC: ± 5 mil (0.13mm)
Die Punch: ± 4 mil (0.1mm)
Min Soldermask Bridge 4mil(0.10mm)
Min BAG PAD Margin 5 mil (0.125mm)
Impedance Controlled Value>50 ohm: ± 10%
Value≤50 Ohm: ± 5 Ohm
Dielectric Strength > 1.3 KV /mm
Wrap & Twist ≤ 0.75%
Flammability 94V-0
Thermal Stress 3 x 10 Sec @ 280 ℃
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold plating,ENEPIG, ENIPIG;HAL, HASL(LF), OSP, Silver Imm., Tin Imm, ENIG+G/F,  Immersion Silver+G/F, Immersion Tin+G/F